JPH0334920Y2 - - Google Patents

Info

Publication number
JPH0334920Y2
JPH0334920Y2 JP1986100309U JP10030986U JPH0334920Y2 JP H0334920 Y2 JPH0334920 Y2 JP H0334920Y2 JP 1986100309 U JP1986100309 U JP 1986100309U JP 10030986 U JP10030986 U JP 10030986U JP H0334920 Y2 JPH0334920 Y2 JP H0334920Y2
Authority
JP
Japan
Prior art keywords
resin
land portion
lead frame
bonded
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986100309U
Other languages
English (en)
Japanese (ja)
Other versions
JPS636751U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986100309U priority Critical patent/JPH0334920Y2/ja
Publication of JPS636751U publication Critical patent/JPS636751U/ja
Application granted granted Critical
Publication of JPH0334920Y2 publication Critical patent/JPH0334920Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1986100309U 1986-06-30 1986-06-30 Expired JPH0334920Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986100309U JPH0334920Y2 (en]) 1986-06-30 1986-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986100309U JPH0334920Y2 (en]) 1986-06-30 1986-06-30

Publications (2)

Publication Number Publication Date
JPS636751U JPS636751U (en]) 1988-01-18
JPH0334920Y2 true JPH0334920Y2 (en]) 1991-07-24

Family

ID=30970013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986100309U Expired JPH0334920Y2 (en]) 1986-06-30 1986-06-30

Country Status (1)

Country Link
JP (1) JPH0334920Y2 (en])

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5461556U (en]) * 1977-10-07 1979-04-28
JPS58441U (ja) * 1981-06-25 1983-01-05 富士通株式会社 プラスチツクパツケ−ジ
JPS58440U (ja) * 1981-06-25 1983-01-05 富士通株式会社 プラスチツクパツケ−ジ
JPS61136249A (ja) * 1984-12-06 1986-06-24 Nec Kansai Ltd ハイブリツドｉｃ

Also Published As

Publication number Publication date
JPS636751U (en]) 1988-01-18

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